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应用于PLP面板级封装 Cu, Ni, SnAg, Au 电镀
pg电子游戏app上海面板级电镀设备可应用于多种工艺的电镀步骤，包括pillar, bump和 RDL。该电镀设备也可运用于微米及亚微米高密度面板封装。
